Laser Depaneling – Precisely What Other Companies Have To Say..

Micron Laser Technology provides PCB Depanelizer and part excising services for consumer products, original equipment manufacturers, and pcb manufacturers. MLT’s numerous laser machining centers are equipped to handle volumes from prototyping to long production runs. Laser depaneling or part excising can cut through metals, plastics, dielectrics, or a combination of both.

Depending on the material and the part requirements, MLT offers a tool-less part removal process in the form of final depaneling, hold-in tabs, scoring (v-grooves), and perforations. These laser processes have the main benefit of speed, positional accuracy, no tooling cost or wear, no part induced stresses, with no cutting oils or some other contaminants.

Hold-in Tabs

Hold-in tabs are small uncut sections regarding the part used to secure the part within the panel. The hold-in tabs are used for easy of handling small parts or part securement for further processing. The hold-in tab width is chosen based on the amount of force desired to removed the part from your panel/sheet or known forces to become applied by downstream processes like component loading or electro-polish. MLT can make tabs in most any material as well as any width and location regarding the part.

Scoring

Laser scoring produces a limited depth ablation line within the part or material set. The depth is generally 50% of the material thickness but may be controlled to some desired depth. The scoring acts similar to the hold-tab to secure the part in the panel or sheet, but allows for individual parts to become ‘snapped’ out. Laser scoring lines may also be used being a deliberate path for stress relief or crack propagation. Prototypes utilize scoring lines in metal to accurately bend and form parts fit without expensive forming dies.

Perforations

Comparable to scoring or v-grooves, laser perforations are another choice for tool-less part removal from a panel or sheet. Perforations could be laser formed to the size and spacing to meet the preferred removal and Motorized PCB Depanelizer. Depending on the material as well as the part requirements, BEST laser services provides a tool-less part removal process by means of final perforation, scoring and hold-in tabs. Utilizing a laser to do the depaneling gives the user the advantage of speed and positional accuracy. Unlike mechanical methods there is no part induced stresses, no tooling cost without any cutting oils or other contaminants.

Laser depaneling is ideal for rigid-flex boards as it possesses a precise approach to cut through a number of materials including but not restricted to the subsequent most common materials seen:

Combinations thereof, appropriate for thicknesses of rigid flex laser depanelization, rigid flex depanelizedIn addition BEST can be that provider of laser depanelization once you have a lot of IoT devices which lmuteg to become precisely machined or cut out to match perfectly into small mechanical enclosures.

Due to the contact-free processing that continues on with laser depanelization of printed circuit boards, there is little distortion even if thin materials are used. When boards are milled or punched out utilizing a mechanical tool there could turn out to be a loss precision and potentially a distortion in the outside board dimensions. Even worse it could crack solder joints when using these mechanical means. In BEST laser depanelization system feature fiducial registration and internet based scaling, which suggests already existing distortions could be compensated and the cut contours positioned precisely in the layout.

The methods for straight line Laser Depaneling, that are create for rectangular-shaped PCBs, all cut or crush the advantage from the board edge. These methods include die cutting, punching or V-scoring the assembly or simply by using a wheel cutter or perhaps a saw. The sawing method typically works with a single rotating blade spinning at high RPM to reduce the panel into the shapes required. This method produces heat within the eliminate area as

well as creating debris being a byproduct in the cutting operation. In V-scoring the depth in the thickness of the board is 30-40% of the original board thickness because it is cut from either side of the board. After assembly the board is broken around this v-score line. Alternately a “pizza cutter” cuts with the V-score of the panel and cuts the remaining web up until the boards have been in their final cutout shape thereby putting strain on the components and solder joints-particularly those nearby the board edge. In another method, the singulated board outline could be punched out constitute the panel. This requires that the new punch be utilized for every kind of circuit board which means it is not a flexible way of board eliminate. The punch force may also bend or deform the sides in the PCB.

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